Overcoming Engineering Challenges to Further Miniaturization
Advancements in Chip-on-Tip endoscopy technology rely on the continued development of sensors, illumination, and lens systems. However, to ensure endoscopes have a viable future, they must continue to shrink in diameter and cost while delivering increasingly high-quality images. To overcome the challenges associated with miniaturization – while not sacrificing quality and performance – specific engineering and manufacturing techniques need to be utilized to ensure optimal chip-on-tip performance. The following white paper examines technological advances driving endoscopic design and how to overcome engineering challenges to ensure successful miniaturization within Chip-on-Tip technologies.
Market Demands for Chip-on-Tip Technology
Chip-on-Tip technology is dramatically changing the boundaries of medical care. Within the medical market-space, the term Chip-on-Tip typically refers to recent advancements in imaging technology used for minimally invasive endoscopic procedures. Endoscopy is defined as “a procedure in which an instrument is introduced into the body to give a view of its internal parts.” Accordingly, devices used to facilitate such procedures are known as endoscopes.
Advancements in sensor technology, especially significant size and cost reductions, have created a paradigm shift within the industry. Lower cost scopes result in the viability of single use devices and increased accessibility to developing countries enabling state of the art medical care to be delivered worldwide.